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IC Chemical Processing
IC Failure Analysis
FIB Application
ESD/Latch-up Test
 
 
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SEM&EDX
Probe Station Application
EMMI Application
OBIRCH Application
LC Application
芯片研磨
De-Gold Bump
X-Ray Application
SAM Application
 
IC Grinding
以世界一流的金相制样设备（美国 ALLIED） 和专注耐心的手工经验，为客户提供精密的金相制样方案。

 
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